BGA PCB Assembly (Business Opportunities - Marketing & Sales)
Hot-Web-Ads > Business Opportunities > Marketing & Sales
Item ID 15779493 in Category: Business Opportunities - Marketing & Sales
BGA PCB Assembly | |
What’s BGA PCB? sales12@hitechpcb.com BGA PCB is Printed Circuit Boards with Ball Grid Array. We use various sophisticated techniques for making BGA PCBs. Such PCBs have a small size, low cost, and high packaging density. Hence, they are reliable for high-performance applications. What’s BGA PCB Assembly? Ball Grid Array (BGA) assembly technology is a surface mount packaging technology applied to integrated circuits, which is often used to permanently fix devices such as microprocessors. BGA assembly can accommodate more pins than other packages such as Dual in-line packages or Quad Flat Packages, and the entire bottom surface of the device can be used as pins , instead of only peripherals available, and also have a shorter average wire length than peripheral-limited package types for better high-speed performance. Our BGA assembly services cover a wide range, including BGA prototype development, BGA PCB assembly, BGA component removal, BGA replacement, BGA rework and reballing, BGA PCB assembly inspection, and so on. Leveraging our full-coverage services, we can help customers streamline the supply network and accelerate product development time. Benefits of BGA PCB Assembly Efficient Use of Space – BGA PCB layout allows us to efficiently use the available space, so we can mount more components and manufacture lighter devices. Better Thermal Performance – For BGA, the heat generated by the components is transferred directly through the ball. In addition, the large contact area improves heat dissipation, which prevents overheating of components and ensures long life. Higher Electrical Conductivity – The path between the die and the circuit board is short, which results in better electrical conductivity. Moreover, there is no through-hole on the board, the whole circuit board is covered with solder balls and other components, so vacant spaces are reduced. Easy to Assemble And Manage – Compared to other PCB assembly techniques, BGA is easier to assemble and manage as the solder balls are used directly to solder the package to the board. Less Damage to Leads – We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during the operation. In a word, BGA PCB assembly, have these advantages, high density, better electrical conductivity, lower thermal resistance, easy to assembly & manage are some of the advantages of BGA PCB.  | |
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| Target State: All States Target City : All Cities Last Update : Sep 23, 2024 2:58 AM Number of Views: 36 | Item Owner : Karen Contact Email: Contact Phone: 18033052358 |
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2024-12-21 (0.226 sec)