CSP substrate (Computers - Hardware)
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Item ID 15787818 in Category: Computers - Hardware
CSP substrate | |
CSP substrate is one of the IC packaging technologies that is used in the formation of microelectronic systems. The size of the package is up to 1 and it can be a combination of parts of the number or only the first part. Two times the die size of the actual die with a single-die package which has direct surface mounts ability. It was first developed in the 1990s as a result of large requirements for small as well as efficient packages. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WahtsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com  | |
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| Target State: All States Target City : Shenzhen Last Update : Sep 30, 2024 7:47 AM Number of Views: 30 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2024-12-18 (0.223 sec)