BOC package substrate (Computers - Hardware)

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Item ID 15795354 in Category: Computers - Hardware

BOC package substrate


BOC package substrate can be described as one of the biggest improvements in semiconductor packaging. They can accommodate high wiring densities, provide miniaturized structures, and enhance electrical characteristics, which make them crucial components in realizing new-generation electronic devices. This ranges from telecommunication and consumer electronics applications; automotive applications; medical devices applications to other advanced technology applications.

Contact Info:-

High Quality PCB Co., Limited

Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China

Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China

Plant 2 address: Zhuhai, Guangdong, China

Plant 3 address: Dongguan, Guangdong, China

TEL: +86-755-23724206

WhatsApp: +86-189 2381 2997

Skype: shawnwang2006

Email: sales@efpcb.com



Target State: All States
Target City : Shenzhen
Last Update : Oct 08, 2024 2:01 AM
Number of Views: 27
Item  Owner  : Shawn Wang
Contact Email:
Contact Phone: +86-755-23724206

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2024-11-18 (0.225 sec)