BOC package substrate (Computers - Hardware)
Hot-Web-Ads > Computers > Hardware
Item ID 15795354 in Category: Computers - Hardware
BOC package substrate | |
BOC package substrate can be described as one of the biggest improvements in semiconductor packaging. They can accommodate high wiring densities, provide miniaturized structures, and enhance electrical characteristics, which make them crucial components in realizing new-generation electronic devices. This ranges from telecommunication and consumer electronics applications; automotive applications; medical devices applications to other advanced technology applications. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WhatsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com  | |
| Target State: All States Target City : Shenzhen Last Update : Oct 08, 2024 2:01 AM Number of Views: 31 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2024-12-18 (0.307 sec)