Flip Chip CSP Substrate: Efficiency, Reliability, and Application (Computers - Hardware)
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Item ID 15878290 in Category: Computers - Hardware
Flip Chip CSP Substrate: Efficiency, Reliability, and Application | |
A flip chip essentially implies that the chip is flipped over to make an association with the substrate or lead outline. Flip chip doesn't rely upon the wire holding for the purpose of interconnection however it utilizes patch or knocks like copper point of support. This implies that the I/O cushions can be put at any part of the outer layer of the chip and consequently the chip size can be diminished with a fitting hardware way. Contact info:-https://efpcb.wordpress.com/2024/09/25/flip-chip-csp-substrate-efficiency-reliability-and-application/  | |
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| Target State: All States Target City : Shenzhen Last Update : Dec 28, 2024 8:47 AM Number of Views: 35 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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2025-01-18 (0.324 sec)