What are SAP and mSAP in Flexible Circuit Fabrication? | |
SAP is the term for “sintered silver adhesive paste” and is a type of conductive paste material to make interconnects in flex circuits. SAP paste is made from a silver flake or microparticles with a polymer adhesive binder on its composition. Unlike conductive inks, SAP uses a post-print heat sintering process where the individuals of the silver particles stick together to form metal-like conductivity and adhere to an adhesive bond layer. Contact info:- https://www.tumblr.com/efpcb/774548649713729536/what-are-sap-and-msap-in-flexible-circuit | |
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| Target State: All States Target City : Shenzhen Last Update : Mar 04, 2025 10:25 AM Number of Views: 40 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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