Heavy Copper PCB Materials | |
Heavy Copper PCBs are used in high-current and high-power applications, requiring materials with excellent conductivity, heat dissipation, and mechanical strength. The main materials include: 1. Substrate Material (Dielectric Material) FR-4 (Glass Fiber Reinforced Epoxy Resin) Features: Commonly used for standard and medium-thickness copper layers (up to 5oz). Advantages: Cost-effective, high mechanical strength, easy to process. Limitations: For copper thickness above 5oz, thermal expansion and heat resistance may become concerns. High-Tg FR-4 (High Glass Transition Temperature FR-4) Features: Higher Tg (Glass Transition Temperature) for better thermal stability. Applications: Suitable for Heavy Copper PCBs with copper thickness above 8oz. Metal Core PCB (MCPCB - Aluminum or Copper Base) Common Materials: Aluminum base, copper base. Features: Excellent thermal conductivity, ideal for high-power applications. Applications: LED lighting, power modules. Ceramic Substrate (Al₂O₃, AlN) Features: Exceptional thermal conductivity, high-temperature resistance, and chemical resistance. Applications: Extreme environments or high-power electronic products, such as power semiconductor modules. 2. Copper Foil Standard Copper Foil (ED Copper - Electrodeposited Copper) Thickness: Typically 35µm (1oz), 70µm (2oz), and up to 400µm (12oz) or more. Features: Suitable for most Heavy Copper PCBs. Rolled Annealed Copper Foil (RA Copper) Features: Better flexibility, suitable for flexible PCBs or specialized applications. 3. Insulating Dielectric (Prepreg & Dielectric Layers) Variable Thickness Prepreg (Semi-cured Sheets) Function: Used for interlayer insulation and mechanical support. Selection Factors: Dielectric constant (Dk), coefficient of thermal expansion (CTE), and heat resistance. 4. Other Materials Resin Fill: Used in thick copper circuits to enhance insulation performance. Thermal Interface Materials (TIMs): Improve heat dissipation in high-power applications. Summary For standard Heavy Copper PCBs (≤6oz), high-Tg FR-4 is the most common choice. For extremely thick copper layers (>10oz), metal-core or ceramic substrates may be required. The material selection depends on factors such as current-carrying capacity, thermal management, and mechanical strength. | |
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